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However, the temperature at the bonding interface could not be measured.
Simulation of ergodic multivariate stochastic processes. The mold is a family mold, as shown in Figure 3B. Semi-active control of a cable-stayed The fabrication technology of the microfluidic chip is developing towards the high efficiency, low cost and large scale direction.
coprologiico By these methods, bonding pressure can be controlled, but the bonding time increases owing to the slow preheating process. The mass ratio and frequency band-width ratio are relatively sensitive among these influence parameters.
Effects of turbulence on bridge flutter derivatives. It was observed that the bond strength increased with increase of bonding temperature.
The spectrum of vertical velocity near the surface. Optimal design of Stewart platforms The name field is required.
At first mold open, the gate will be cut automatically to remove sprue by the ejection unit of the injection molding machine, so as not to interfere with the second mold close.
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Both the vertical and the lateral vibrations can be effectively controlled when proper design parameters of a MTMD system are used. Tropical medicine and Parasitology ; Volume 32 Issue Decpp.
By using the comment function on degruyter. The microchannels deformation is most sensitive to the temperature.
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Research on key techniques for polymeric microfluidic chips preparation, Doctoral dissertation. The fitted curves are used as an aid for data visualization, to summarize the relationships among variables.
The traditional fabrication method of microfluidic chip includes molding of the chip substrate and cover sheet, cooling, cleaning, alignment, heating, thermal bonding, and cooling etc. Volume 12 Issue 4 Augpp. The influence of bonding temperature on bonding strength is presented in Figure However, the bonding time should exceed s to guarantee excellent sealing of the chip.
Add a review and share your thoughts with itnerpretacion readers. Interpretacoin analysis of coupled buffeting response of bridges: With the continuous development of life science technology, small intdrpretacion microfluidic chip production in the laboratory cannot satisfy the growing market.
You may send this item to up to five recipients. Finding libraries that hold this item Time-domain buffeting analysis of the SCB 6. Inrerpretacion list has reached the maximum number of items. In the process of bonding, the bonding temperature interpretaclon supplied by the mold. In-mold bonding experiments of the microfluidic chip were carried out to decrease the microchannels deformation, raise the bonding strength and reduce the production cycle of the chip.
The microchannels deformation would be increased with increase of bonding temperature, bonding pressure and bonding time. With regards to the required bonding strength, it is better to choose a smaller bonding pressure. Performance of LIDAR- and radar-based turbulence intensity measurement in comparison with anemometer-based turbulence intensity estimation based on aircraft data for a typical case of terrain-induced turbulence in association with a typhoon.