SKHynix had lots and lots of memory goodies at IDF including some vertical/3D NAND flash, LPDDR3, and HBM modules. This material is proprietary of SK hynix Inc. and subject to change without TSV is a revolutionary technology for overcoming the bottleneck. On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D.

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We observed a decrease of patent applications the last two years, while the first products appeared on the market. The deep analysis of the patent portfolios held by key players includes a point on relevant technologies for future developments of TSV stacked memories. S A Have you signed up for our newsletter yet? The top right box is the interesting one, labeled Ci-MCP. That said it is the future of memory so make sure you are familiar with this little grey blob, you will be seeing lots of them in the near future.

Instead of putting transistors on a flat plane with wiring in the third dimension, Hynix, like Samsung, is stacking the cells vertically. Both companies have settled on 24 cells deep, exactly the break point that AMAT said would be economically feasible to make the switch. Sorry, your blog cannot share posts by email.

Charlie is also a council member with Gerson Lehman Group. The memory market has been impacted by the increased difficultly in producing at more compact geometries.

The patent landscape for TSV stacked memory analyzed in this report is quite closed with microelectronics giants and dominated by American and Asian patent applicants. First patents involving TSV stacked memories were already published in the s, but the development of the technology really started in the hyinx with a significant increase of patent publications since then. Have you signed up for our newsletter yet?


Hynix shows off bleeding edge 3D NAND, TSV based DDR3, and HBM modules

Did you know that you can access all our past subscription-only articles with a simple Student Membership for USD per year? To this date, more than patent families relating to TSV stacked memory technology have been published.

Latest posts by Charlie Demerjian see all. Like what you may wonder? In the semiconductor industry, 3D integration using through-silicon via TSV has been considered to be a promising way for improving performance and density instead of conventional device scaling. ForSamsung predicts tsc two future paths: Once Android makes the bit leap this will matter a lot. Username or Email Address.

Tvs with higher capacity and higher bandwidth and low cost HBM with significant cost savings arrive from the narrower width allowing for simpler memory stacks with less TSVs.

The following two tabs change content below. Mobile formats by the 1. All main applicants in TSV stacked memory technologies are microelectronics giants.

Further this leads to the reduction of power consumption as well as parasitic resistance and capacitance. The USA and Korea represent the main countries of patent filings, while Europe seems to represent only few interest for patent applicants. It is pretty mind bending stuff. This database allows multi-criteria searches and includes patent publication number, hyperlinks to the original documents, priority date, title, abstract, patent assignees and hynox status for each member of the patent family.


The report provides a ranking and analysis of the relative strength of the top patent holders derived from their portfolio size, countries of patents filings, current legal status of patents, segmentation of their IP portfolio. Mount this on to your phone or tablet SoC and off you go, no other memory needed in the system.

If you want both bleeding edge tech and a company that actually will talk to journalists, Hynix was the place to be. Add to Cart Checkout Added to cart. Username or Email Address Password. As head writer of SemiAccurate.

Hynix shows off bleeding edge 3D NAND, TSV based DDR3, and HBM modules – SemiAccurate

Most of them are American or Asian. Sep 23, by Charlie Demerjian. Could tdv get better? A focus is also provided on key challenges for TSV stacked memory technology error repair, multi-channel package, thermal dissipation, alignment accuracy, connection failure and solutions found in patents owned by key players. Charlie Demerjian Roving engine of chaos and snide remarks at SemiAccurate.

He is a technologist and analyst specializing in semiconductors, system and network architecture. Main challenges for the future remain the quest for higher bandwidth and density integration. This report provides a complete and deep understanding of Hynx litigation history including litigated patents families and inter-partes reviews.

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